Tungsten powders and Ce doped powders were prepared by hydrogen reduction combined with the liquid-solid doping method. The phase composition, particle size and powder morphology of Ce doped tungsten powders were analyzed by X-ray diffrac-tion, scanning electron microscopy and transmission electron microscopy, respectively. The results indicated that 10000 ppm Ce doped tungsten oxide powders were consisted of WO3 phase and Ce4W9O33 phase. The hydrogen reduction of Ce doped tungsten powders was basically accomplished at 800 oC for 3 h. The size of Ce doped W powders was remarkably decreased compared to the undoped W powders. The phase of Ce4W9O33 was reduced to Ce2 （WO4）3 phase and Ce2W2O9 phase during the process of hydrogen reduction. Moreover, Ce2 （WO4）3 phase and Ce2W2O9 phase were observed form their morphologies, where the doping content of Ce was more than 100 ppm. The ternary phase embedding into W particles was assigned to Ce2 （WO4）3, while the ternary phase distrib-uting among W particles corresponded to Ce2W2O9. The phase of Ce2 （WO4）3 might be the nucleus of W particles and increase the number of the nucleus. And the particles of Ce2W2O9 covered WO2 particles and might inhibit the growth of W particles. These two reasons resulted in the decrease of the size of Ce doped W particles. Uniform fine W powders were fabricated with the doping content of Ce more than 100 ppm.
This article explores tile effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn- 9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-gZn solder alloy.
