在Si(001)衬底上,以高质量的弛豫Ge薄膜作为缓冲层,先后生长Sn组分x分别为2.5%,5.2%和7.8%的完全应变的三层Ge_(1-x)Sn_x合金薄膜.在Si(001)衬底上直接生长了x分别为0.005,0.016,0.044,0.070和0.155的五个弛豫Ge_(1-x)Sn_x样品.通过卢瑟福背散射谱、高分辨X射线衍射和X射线倒易空间图等方法测量了Ge_(1-x)Sn_x合金的组分与晶格常数.实验得到的晶格常数相对Vegard定律具有较大的正偏离,弯曲系数b=0.211 A.
Silicon photonics has become one of the major technologies in this very information age. It has been intensively pursued by researchers and entrepreneurs all over the world in recent years. Achieving the large scale silicon photonic integration, particularly monolithic integration, is the final goal so that high density data communication will become much cheaper, more reliable, and less energy consuming. Comparing with the developed countries, China may need to invest more to develop top down nanoscale integration capability （more on processing technology） to sustain the development in silicon photonics and to elevate its own industry structure.
This paper reviews the recent progress in photonic devices application of Ge-on-Si. Ge-on-Si materials and optical devices are suitable candidates for Si-based optoelectronic integration because of the mature epitaxial technique and the compatibility with Si complementary metal-oxide-semiconductor （CMOS） technology. Recently, the realities of electric-pump Ge light emitting diode （LED） and optical-pump pulse Ge laser, Ge quantum well modulator based on quantum Stark confined effect, waveguide Ge modulator based on Franz-Keldysh （FK） effect, and high performance near-infrared Ge detector, rendered the Si-based optoelectronic integration using Ge photonic devices. Ge-on-Si material is also an important platform to grow other materials on it for Si- based optoelectronic integration. InGaAs and GeSn have been grown on the Ge-on-Si. InGaAs LED and GeSn photodetector have been successfully fabricated as well.
Weixuan HUBuwen CHENGChunlai XUEShaojian SUHaiyun XUEYuhua ZUOQiming WANG
