The competition of surface and subsurface crack initiation induced failure is critical to understand very high cycle fatigue（VHCF） behavior, which necessitates the elucidation of the underlying mechanisms for the transition of crack initiation from surface to interior defects. Crack initiation potential in materials containing defects is investigated numerically by focusing on defect types, size, shape, location, and residual stress influences. Results show that the crack initiation potency is higher in case of serious property mismatching between matrix and defects, and higher strength materials are more sensitive to soft inclusions（elastic modulus lower than the matrix）. The stress localization around inclusions are correlated to interior crack initiation mechanisms in the VHCF regime such as inclusion-matrix debonding at soft inclusions and inclusion-cracking for hard inclusions（elastic modulus higher than the matrix）. It is easier to emanate cracks from the subsurface pores with the depth 0.7 times as large as their diameter. There exists an inclusion size independent region for crack incubation, outside which crack initiation will transfer from the subsurface soft inclusion to the interior larger one. As for elliptical inclusions, reducing the short-axis length can decrease the crack nucleation potential and promote the interior crack formation, whereas the long-axis length controls the site of peak stress concentration. The compressive residual stress at surface is helpful to shift crack initiation from surface to interior inclusions. Some relaxation of residual stress can not change the inherent crack initiation from interior inclusions in the VHCF regime. The work reveals the crack initiation potential and the transition among various defects under the influences of both intrinsic and extrinsic factors in the VHCF regime, and is helpful to understand the failure mechanism of materials containing defects under long-term cyclic loadings.
对NiCrMoV转子钢焊接接头,将初始裂纹置于热影响区的完全淬火-回火区、不完全淬火-回火区和回火区,基于扫描电镜(Scanning electron microscopy,SEM)-微拉伸试验装置,开展真空条件下疲劳短裂纹扩展行为的原位试验,研究焊接接头热处理后微区的疲劳破坏机理。结果表明,热影响区内疲劳物理短裂纹的扩展是不连续的,K仍可作为裂纹扩展的驱动参量,材料强度水平控制疲劳短裂纹扩展方向。在完全淬火-回火区,短裂纹扩展受到大尺寸晶粒和板条马氏体的影响,裂纹易偏折,疲劳抗力最好;而回火区的晶粒尺寸和强度较小,疲劳门槛值较低,裂纹抗力较弱。在不完全淬火-回火区,晶界析出碳化物较多,疲劳裂纹主要以沿晶方式扩展,裂纹扩展抗力最差。
