Ta/NiFe/Bi(Ag, Cu)/FeMn/Ta and Ta/ NiFeⅠ /FeMn/Bi(Ag, Cu)/NiFeⅡ/Ta films were prepared by magnetic sputtering. The texture of films was examined by X-ray diffraction (XRD). The depend-ence of the Hex1 between NiFeⅠ/FeMn films and the Hex2 between FeMn/NiFeⅡ on the Bi, Ag and Cu thickness was studied in Ta/NiFeⅠ/FeMn/Bi(Ag, Cu)/ NiFeⅡ/Ta. The experimental results show that the He1 ranged from 130 to 140 Oe with an increase in the nonmagnetic metal spacer thickness. The Hex2 de-creased dramatically and became flat finally with the increase of the Bi, Ag and Cu thickness. XPS results show that Bi, Ag and Cu atoms do not stay entirely at the interface of FeMn/NiFeⅡ film; they are at least partly segregated to the surface of NiFe film. The more Bi, Ag and Cu atoms are deposited, the more they are segregated at the NiFe layer.
Ta / NiFe/Bi （ Ag, Cu ）/FeMn/Ta and Ta / NiFe1/FeMn / Bi （ Ag, Cu ）/NiFen/Ta films were prepared by magnetic sputtering. The texture and the dependences of the exchange-coupling field on the thickness of Bi, Ag, and Cu in Ta/NiFe/Bi（Ag, Cu） /FeMn/Ta and Ta/NiFe/FeMn/Bi（Ag, Cu）/NiFe/Ta films were studied. XPS results indicate that the Bi atoms migrated into the FeMn layer during the deposition process and a FeMnBi alloy was probably formed or the Bi atoms existed as an impurity in the FeMn layer in Ta/NiFe/Bi（Ag, Cu ）/FeMn/Ta. Otherwise, in Ta/NiFe/FeMn/Bi （Ag, Cu）/NiFe/Ta films, Bi, Ag, and Cu atoms do not remain entirely at the interface of the FeMn/ NiFeⅡfilm, but at least partly segregate to the surface of the NiFe film.
